JPS509070A - - Google Patents
Info
- Publication number
- JPS509070A JPS509070A JP48060508A JP6050873A JPS509070A JP S509070 A JPS509070 A JP S509070A JP 48060508 A JP48060508 A JP 48060508A JP 6050873 A JP6050873 A JP 6050873A JP S509070 A JPS509070 A JP S509070A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6050873A JPS5519055B2 (ja) | 1973-05-29 | 1973-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6050873A JPS5519055B2 (ja) | 1973-05-29 | 1973-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS509070A true JPS509070A (ja) | 1975-01-30 |
| JPS5519055B2 JPS5519055B2 (ja) | 1980-05-23 |
Family
ID=13144309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6050873A Expired JPS5519055B2 (ja) | 1973-05-29 | 1973-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5519055B2 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57992A (en) * | 1980-06-02 | 1982-01-06 | Mitsubishi Heavy Ind Ltd | Oscillation reducing apparatus for workboat or the like |
-
1973
- 1973-05-29 JP JP6050873A patent/JPS5519055B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5519055B2 (ja) | 1980-05-23 |