JPS5089266U - - Google Patents

Info

Publication number
JPS5089266U
JPS5089266U JP14540573U JP14540573U JPS5089266U JP S5089266 U JPS5089266 U JP S5089266U JP 14540573 U JP14540573 U JP 14540573U JP 14540573 U JP14540573 U JP 14540573U JP S5089266 U JPS5089266 U JP S5089266U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14540573U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14540573U priority Critical patent/JPS5089266U/ja
Publication of JPS5089266U publication Critical patent/JPS5089266U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP14540573U 1973-12-17 1973-12-17 Pending JPS5089266U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14540573U JPS5089266U (de) 1973-12-17 1973-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14540573U JPS5089266U (de) 1973-12-17 1973-12-17

Publications (1)

Publication Number Publication Date
JPS5089266U true JPS5089266U (de) 1975-07-29

Family

ID=28432050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14540573U Pending JPS5089266U (de) 1973-12-17 1973-12-17

Country Status (1)

Country Link
JP (1) JPS5089266U (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01231380A (ja) * 1988-03-11 1989-09-14 Shin Etsu Handotai Co Ltd 混色発光半導体素子
EP1968115A2 (de) * 2007-03-09 2008-09-10 Ivoclar Vivadent AG Lichtemissionsvorrichtung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01231380A (ja) * 1988-03-11 1989-09-14 Shin Etsu Handotai Co Ltd 混色発光半導体素子
EP1968115A2 (de) * 2007-03-09 2008-09-10 Ivoclar Vivadent AG Lichtemissionsvorrichtung

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