JPS5088990A - - Google Patents
Info
- Publication number
- JPS5088990A JPS5088990A JP48136782A JP13678273A JPS5088990A JP S5088990 A JPS5088990 A JP S5088990A JP 48136782 A JP48136782 A JP 48136782A JP 13678273 A JP13678273 A JP 13678273A JP S5088990 A JPS5088990 A JP S5088990A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Light Receiving Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48136782A JPS5088990A (ja) | 1973-12-10 | 1973-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48136782A JPS5088990A (ja) | 1973-12-10 | 1973-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5088990A true JPS5088990A (ja) | 1975-07-17 |
Family
ID=15183380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48136782A Pending JPS5088990A (ja) | 1973-12-10 | 1973-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5088990A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59141251A (ja) * | 1983-02-01 | 1984-08-13 | Mitsubishi Electric Corp | 半導体装置パツケ−ジ |
-
1973
- 1973-12-10 JP JP48136782A patent/JPS5088990A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59141251A (ja) * | 1983-02-01 | 1984-08-13 | Mitsubishi Electric Corp | 半導体装置パツケ−ジ |