JPS5088636A - - Google Patents

Info

Publication number
JPS5088636A
JPS5088636A JP13780673A JP13780673A JPS5088636A JP S5088636 A JPS5088636 A JP S5088636A JP 13780673 A JP13780673 A JP 13780673A JP 13780673 A JP13780673 A JP 13780673A JP S5088636 A JPS5088636 A JP S5088636A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13780673A
Other versions
JPS529978B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13780673A priority Critical patent/JPS529978B2/ja
Publication of JPS5088636A publication Critical patent/JPS5088636A/ja
Publication of JPS529978B2 publication Critical patent/JPS529978B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP13780673A 1973-12-12 1973-12-12 Expired JPS529978B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13780673A JPS529978B2 (ja) 1973-12-12 1973-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13780673A JPS529978B2 (ja) 1973-12-12 1973-12-12

Publications (2)

Publication Number Publication Date
JPS5088636A true JPS5088636A (ja) 1975-07-16
JPS529978B2 JPS529978B2 (ja) 1977-03-19

Family

ID=15207273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13780673A Expired JPS529978B2 (ja) 1973-12-12 1973-12-12

Country Status (1)

Country Link
JP (1) JPS529978B2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137502U (ja) * 1982-03-11 1983-09-16 日本鋼管株式会社 エロンゲ−タのバ−自動交換設備

Also Published As

Publication number Publication date
JPS529978B2 (ja) 1977-03-19

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