JPS508496B1 - - Google Patents
Info
- Publication number
- JPS508496B1 JPS508496B1 JP45076381A JP7638170A JPS508496B1 JP S508496 B1 JPS508496 B1 JP S508496B1 JP 45076381 A JP45076381 A JP 45076381A JP 7638170 A JP7638170 A JP 7638170A JP S508496 B1 JPS508496 B1 JP S508496B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45076381A JPS508496B1 (ja) | 1970-09-02 | 1970-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45076381A JPS508496B1 (ja) | 1970-09-02 | 1970-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS508496B1 true JPS508496B1 (ja) | 1975-04-04 |
Family
ID=13603741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45076381A Pending JPS508496B1 (ja) | 1970-09-02 | 1970-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS508496B1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019160928A (ja) * | 2018-03-09 | 2019-09-19 | 日本電気株式会社 | 回路基板、基板接続構造、及び回路基板の製造方法 |
-
1970
- 1970-09-02 JP JP45076381A patent/JPS508496B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019160928A (ja) * | 2018-03-09 | 2019-09-19 | 日本電気株式会社 | 回路基板、基板接続構造、及び回路基板の製造方法 |