JPS5081066A - - Google Patents
Info
- Publication number
- JPS5081066A JPS5081066A JP48128548A JP12854873A JPS5081066A JP S5081066 A JPS5081066 A JP S5081066A JP 48128548 A JP48128548 A JP 48128548A JP 12854873 A JP12854873 A JP 12854873A JP S5081066 A JPS5081066 A JP S5081066A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48128548A JPS5081066A (enrdf_load_html_response) | 1973-11-15 | 1973-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48128548A JPS5081066A (enrdf_load_html_response) | 1973-11-15 | 1973-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5081066A true JPS5081066A (enrdf_load_html_response) | 1975-07-01 |
Family
ID=14987467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48128548A Pending JPS5081066A (enrdf_load_html_response) | 1973-11-15 | 1973-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5081066A (enrdf_load_html_response) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5599153U (enrdf_load_html_response) * | 1978-12-28 | 1980-07-10 | ||
| JPH05166958A (ja) * | 1991-12-13 | 1993-07-02 | Kyocera Corp | 半導体素子収納用パッケージ |
-
1973
- 1973-11-15 JP JP48128548A patent/JPS5081066A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5599153U (enrdf_load_html_response) * | 1978-12-28 | 1980-07-10 | ||
| JPH05166958A (ja) * | 1991-12-13 | 1993-07-02 | Kyocera Corp | 半導体素子収納用パッケージ |