JPS5077862A - - Google Patents
Info
- Publication number
- JPS5077862A JPS5077862A JP12726573A JP12726573A JPS5077862A JP S5077862 A JPS5077862 A JP S5077862A JP 12726573 A JP12726573 A JP 12726573A JP 12726573 A JP12726573 A JP 12726573A JP S5077862 A JPS5077862 A JP S5077862A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12726573A JPS5077862A (ko) | 1973-11-14 | 1973-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12726573A JPS5077862A (ko) | 1973-11-14 | 1973-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5077862A true JPS5077862A (ko) | 1975-06-25 |
Family
ID=14955735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12726573A Pending JPS5077862A (ko) | 1973-11-14 | 1973-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5077862A (ko) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54161069A (en) * | 1978-06-12 | 1979-12-20 | Fujitsu Ltd | Antiifluidization method of solder |
| JPS5835585A (ja) * | 1981-08-27 | 1983-03-02 | セイコーエプソン株式会社 | 液晶表示体装置 |
| JPS5858374U (ja) * | 1981-10-14 | 1983-04-20 | 日本電気株式会社 | 印刷基板 |
| JPS58114530U (ja) * | 1982-01-25 | 1983-08-05 | ミツミ電機株式会社 | ビデオテ−プレコ−ダ用磁気ヘツド装置 |
| JPS61188942A (ja) * | 1985-02-15 | 1986-08-22 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | はんだ接続体及びその形成方法 |
| JPH0462945A (ja) * | 1990-07-02 | 1992-02-27 | Oki Electric Ind Co Ltd | フリップチップ実装方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49128261A (ko) * | 1973-04-13 | 1974-12-09 |
-
1973
- 1973-11-14 JP JP12726573A patent/JPS5077862A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49128261A (ko) * | 1973-04-13 | 1974-12-09 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54161069A (en) * | 1978-06-12 | 1979-12-20 | Fujitsu Ltd | Antiifluidization method of solder |
| JPS5835585A (ja) * | 1981-08-27 | 1983-03-02 | セイコーエプソン株式会社 | 液晶表示体装置 |
| JPS5858374U (ja) * | 1981-10-14 | 1983-04-20 | 日本電気株式会社 | 印刷基板 |
| JPH0225251Y2 (ko) * | 1981-10-14 | 1990-07-11 | ||
| JPS58114530U (ja) * | 1982-01-25 | 1983-08-05 | ミツミ電機株式会社 | ビデオテ−プレコ−ダ用磁気ヘツド装置 |
| JPS61188942A (ja) * | 1985-02-15 | 1986-08-22 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | はんだ接続体及びその形成方法 |
| JPH0462945A (ja) * | 1990-07-02 | 1992-02-27 | Oki Electric Ind Co Ltd | フリップチップ実装方法 |