JPS50752A - - Google Patents
Info
- Publication number
- JPS50752A JPS50752A JP48048526A JP4852673A JPS50752A JP S50752 A JPS50752 A JP S50752A JP 48048526 A JP48048526 A JP 48048526A JP 4852673 A JP4852673 A JP 4852673A JP S50752 A JPS50752 A JP S50752A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8336—Bonding interfaces of the semiconductor or solid state body
- H01L2224/83365—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48048526A JPS50752A (ja) | 1973-05-02 | 1973-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48048526A JPS50752A (ja) | 1973-05-02 | 1973-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50752A true JPS50752A (ja) | 1975-01-07 |
Family
ID=12805794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48048526A Pending JPS50752A (ja) | 1973-05-02 | 1973-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50752A (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51154154U (ja) * | 1975-06-03 | 1976-12-08 | ||
| JPS5928330U (ja) * | 1982-08-12 | 1984-02-22 | 日本ノーション工業株式会社 | ベルト調節具 |
| JPS6124520U (ja) * | 1985-05-11 | 1986-02-13 | 日本ノ−シヨン工業株式会社 | 合成樹脂製なす環 |
| JPS6184218U (ja) * | 1985-05-11 | 1986-06-03 | ||
| US4868954A (en) * | 1982-07-23 | 1989-09-26 | Nippon Notion Kogyo Co., Ltd. | Swivel joint assembly |
-
1973
- 1973-05-02 JP JP48048526A patent/JPS50752A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51154154U (ja) * | 1975-06-03 | 1976-12-08 | ||
| US4868954A (en) * | 1982-07-23 | 1989-09-26 | Nippon Notion Kogyo Co., Ltd. | Swivel joint assembly |
| JPS5928330U (ja) * | 1982-08-12 | 1984-02-22 | 日本ノーション工業株式会社 | ベルト調節具 |
| JPH0131064Y2 (ja) * | 1982-08-12 | 1989-09-22 | ||
| JPS6124520U (ja) * | 1985-05-11 | 1986-02-13 | 日本ノ−シヨン工業株式会社 | 合成樹脂製なす環 |
| JPS6184218U (ja) * | 1985-05-11 | 1986-06-03 | ||
| JPS634813Y2 (ja) * | 1985-05-11 | 1988-02-08 | ||
| JPH0223848Y2 (ja) * | 1985-05-11 | 1990-06-29 |