JPS5074278U - - Google Patents
Info
- Publication number
- JPS5074278U JPS5074278U JP1973130040U JP13004073U JPS5074278U JP S5074278 U JPS5074278 U JP S5074278U JP 1973130040 U JP1973130040 U JP 1973130040U JP 13004073 U JP13004073 U JP 13004073U JP S5074278 U JPS5074278 U JP S5074278U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/073—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973130040U JPS5074278U (ja) | 1973-11-09 | 1973-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973130040U JPS5074278U (ja) | 1973-11-09 | 1973-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5074278U true JPS5074278U (ja) | 1975-06-28 |
Family
ID=28388836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973130040U Pending JPS5074278U (ja) | 1973-11-09 | 1973-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5074278U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018046186A (ja) * | 2016-09-15 | 2018-03-22 | 株式会社デンソー | 半導体装置およびその製造方法 |
-
1973
- 1973-11-09 JP JP1973130040U patent/JPS5074278U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018046186A (ja) * | 2016-09-15 | 2018-03-22 | 株式会社デンソー | 半導体装置およびその製造方法 |