JPS5074277U - - Google Patents
Info
- Publication number
- JPS5074277U JPS5074277U JP1973128592U JP12859273U JPS5074277U JP S5074277 U JPS5074277 U JP S5074277U JP 1973128592 U JP1973128592 U JP 1973128592U JP 12859273 U JP12859273 U JP 12859273U JP S5074277 U JPS5074277 U JP S5074277U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Electric Clocks (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973128592U JPS5524860Y2 (ja) | 1973-11-08 | 1973-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973128592U JPS5524860Y2 (ja) | 1973-11-08 | 1973-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5074277U true JPS5074277U (ja) | 1975-06-28 |
| JPS5524860Y2 JPS5524860Y2 (ja) | 1980-06-14 |
Family
ID=28384752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973128592U Expired JPS5524860Y2 (ja) | 1973-11-08 | 1973-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5524860Y2 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3404215A (en) * | 1966-04-14 | 1968-10-01 | Sprague Electric Co | Hermetically sealed electronic module |
-
1973
- 1973-11-08 JP JP1973128592U patent/JPS5524860Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3404215A (en) * | 1966-04-14 | 1968-10-01 | Sprague Electric Co | Hermetically sealed electronic module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5524860Y2 (ja) | 1980-06-14 |