JPS5072173U - - Google Patents

Info

Publication number
JPS5072173U
JPS5072173U JP12650173U JP12650173U JPS5072173U JP S5072173 U JPS5072173 U JP S5072173U JP 12650173 U JP12650173 U JP 12650173U JP 12650173 U JP12650173 U JP 12650173U JP S5072173 U JPS5072173 U JP S5072173U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12650173U
Other versions
JPS5315256Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12650173U priority Critical patent/JPS5315256Y2/ja
Publication of JPS5072173U publication Critical patent/JPS5072173U/ja
Application granted granted Critical
Publication of JPS5315256Y2 publication Critical patent/JPS5315256Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP12650173U 1973-11-02 1973-11-02 Expired JPS5315256Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12650173U JPS5315256Y2 (ja) 1973-11-02 1973-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12650173U JPS5315256Y2 (ja) 1973-11-02 1973-11-02

Publications (2)

Publication Number Publication Date
JPS5072173U true JPS5072173U (ja) 1975-06-25
JPS5315256Y2 JPS5315256Y2 (ja) 1978-04-21

Family

ID=28378866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12650173U Expired JPS5315256Y2 (ja) 1973-11-02 1973-11-02

Country Status (1)

Country Link
JP (1) JPS5315256Y2 (ja)

Also Published As

Publication number Publication date
JPS5315256Y2 (ja) 1978-04-21

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