JPS5068476A - - Google Patents

Info

Publication number
JPS5068476A
JPS5068476A JP11762073A JP11762073A JPS5068476A JP S5068476 A JPS5068476 A JP S5068476A JP 11762073 A JP11762073 A JP 11762073A JP 11762073 A JP11762073 A JP 11762073A JP S5068476 A JPS5068476 A JP S5068476A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11762073A
Other languages
Japanese (ja)
Other versions
JPS5225299B2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11762073A priority Critical patent/JPS5225299B2/ja
Priority to US05/513,924 priority patent/US3972063A/en
Publication of JPS5068476A publication Critical patent/JPS5068476A/ja
Publication of JPS5225299B2 publication Critical patent/JPS5225299B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Details Of Measuring And Other Instruments (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP11762073A 1973-10-19 1973-10-19 Expired JPS5225299B2 (enrdf_load_html_response)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11762073A JPS5225299B2 (enrdf_load_html_response) 1973-10-19 1973-10-19
US05/513,924 US3972063A (en) 1973-10-19 1974-10-10 Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11762073A JPS5225299B2 (enrdf_load_html_response) 1973-10-19 1973-10-19

Publications (2)

Publication Number Publication Date
JPS5068476A true JPS5068476A (enrdf_load_html_response) 1975-06-07
JPS5225299B2 JPS5225299B2 (enrdf_load_html_response) 1977-07-06

Family

ID=14716248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11762073A Expired JPS5225299B2 (enrdf_load_html_response) 1973-10-19 1973-10-19

Country Status (1)

Country Link
JP (1) JPS5225299B2 (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170558A (en) * 1981-04-14 1982-10-20 Mitsubishi Electric Corp Boiling cooling type semiconductor device
EP4415039A1 (de) * 2023-02-07 2024-08-14 Siemens Aktiengesellschaft Leistungshalbleitermodul mit druckkontaktierungen

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139682U (ja) * 1983-03-08 1984-09-18 株式会社富士通ゼネラル パイプ插通孔閉塞具
JPS59139681U (ja) * 1983-03-08 1984-09-18 株式会社富士通ゼネラル パイプ插通孔閉塞具
US7151671B2 (en) * 2001-12-04 2006-12-19 Tokyo R & D Co., Ltd. Power supply

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170558A (en) * 1981-04-14 1982-10-20 Mitsubishi Electric Corp Boiling cooling type semiconductor device
EP4415039A1 (de) * 2023-02-07 2024-08-14 Siemens Aktiengesellschaft Leistungshalbleitermodul mit druckkontaktierungen
WO2024165559A1 (de) * 2023-02-07 2024-08-15 Siemens Aktiengesellschaft Leistungshalbleitermodul mit druckkontaktierungen

Also Published As

Publication number Publication date
JPS5225299B2 (enrdf_load_html_response) 1977-07-06

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