JPS5068476A - - Google Patents
Info
- Publication number
- JPS5068476A JPS5068476A JP11762073A JP11762073A JPS5068476A JP S5068476 A JPS5068476 A JP S5068476A JP 11762073 A JP11762073 A JP 11762073A JP 11762073 A JP11762073 A JP 11762073A JP S5068476 A JPS5068476 A JP S5068476A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11762073A JPS5225299B2 (cg-RX-API-DMAC10.html) | 1973-10-19 | 1973-10-19 | |
| US05/513,924 US3972063A (en) | 1973-10-19 | 1974-10-10 | Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11762073A JPS5225299B2 (cg-RX-API-DMAC10.html) | 1973-10-19 | 1973-10-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5068476A true JPS5068476A (cg-RX-API-DMAC10.html) | 1975-06-07 |
| JPS5225299B2 JPS5225299B2 (cg-RX-API-DMAC10.html) | 1977-07-06 |
Family
ID=14716248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11762073A Expired JPS5225299B2 (cg-RX-API-DMAC10.html) | 1973-10-19 | 1973-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5225299B2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57170558A (en) * | 1981-04-14 | 1982-10-20 | Mitsubishi Electric Corp | Boiling cooling type semiconductor device |
| EP4415039A1 (de) * | 2023-02-07 | 2024-08-14 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit druckkontaktierungen |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59139681U (ja) * | 1983-03-08 | 1984-09-18 | 株式会社富士通ゼネラル | パイプ插通孔閉塞具 |
| JPS59139682U (ja) * | 1983-03-08 | 1984-09-18 | 株式会社富士通ゼネラル | パイプ插通孔閉塞具 |
| WO2003049518A1 (fr) * | 2001-12-04 | 2003-06-12 | Tokyo R & D Co., Ltd. | Alimentation de courant |
-
1973
- 1973-10-19 JP JP11762073A patent/JPS5225299B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57170558A (en) * | 1981-04-14 | 1982-10-20 | Mitsubishi Electric Corp | Boiling cooling type semiconductor device |
| EP4415039A1 (de) * | 2023-02-07 | 2024-08-14 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit druckkontaktierungen |
| WO2024165559A1 (de) * | 2023-02-07 | 2024-08-15 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit druckkontaktierungen |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5225299B2 (cg-RX-API-DMAC10.html) | 1977-07-06 |