JPS5068275A - - Google Patents

Info

Publication number
JPS5068275A
JPS5068275A JP49004383A JP438374A JPS5068275A JP S5068275 A JPS5068275 A JP S5068275A JP 49004383 A JP49004383 A JP 49004383A JP 438374 A JP438374 A JP 438374A JP S5068275 A JPS5068275 A JP S5068275A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49004383A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5068275A publication Critical patent/JPS5068275A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W40/611—
    • H10W78/00—
    • H10W40/60—
    • H10W40/625—

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP49004383A 1973-10-15 1973-12-25 Pending JPS5068275A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732351637 DE2351637A1 (de) 1973-10-15 1973-10-15 Halter fuer ein halbleiterbauelement

Publications (1)

Publication Number Publication Date
JPS5068275A true JPS5068275A (ja) 1975-06-07

Family

ID=5895448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49004383A Pending JPS5068275A (ja) 1973-10-15 1973-12-25

Country Status (2)

Country Link
JP (1) JPS5068275A (ja)
DE (1) DE2351637A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118662A (en) * 1979-03-05 1980-09-11 Alsthom Atlantique Power semiconductor chip support for dipping in hydrogen carbide fluorine
JPS5837929A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 半導体装置の電極を導出する装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern
DE102011004541B4 (de) * 2011-02-22 2014-07-17 Infineon Technologies Bipolar Gmbh & Co. Kg Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls
US11776874B2 (en) * 2020-03-24 2023-10-03 Solaredge Technologies Ltd. Apparatus and method for holding a heat generating device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4412424Y1 (ja) * 1966-06-17 1969-05-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4412424Y1 (ja) * 1966-06-17 1969-05-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118662A (en) * 1979-03-05 1980-09-11 Alsthom Atlantique Power semiconductor chip support for dipping in hydrogen carbide fluorine
JPS5837929A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 半導体装置の電極を導出する装置

Also Published As

Publication number Publication date
DE2351637A1 (de) 1975-04-24

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