JPS50674Y1 - - Google Patents

Info

Publication number
JPS50674Y1
JPS50674Y1 JP1969034106U JP3410669U JPS50674Y1 JP S50674 Y1 JPS50674 Y1 JP S50674Y1 JP 1969034106 U JP1969034106 U JP 1969034106U JP 3410669 U JP3410669 U JP 3410669U JP S50674 Y1 JPS50674 Y1 JP S50674Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1969034106U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1969034106U priority Critical patent/JPS50674Y1/ja
Publication of JPS50674Y1 publication Critical patent/JPS50674Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1969034106U 1969-04-14 1969-04-14 Expired JPS50674Y1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1969034106U JPS50674Y1 (ja) 1969-04-14 1969-04-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1969034106U JPS50674Y1 (ja) 1969-04-14 1969-04-14

Publications (1)

Publication Number Publication Date
JPS50674Y1 true JPS50674Y1 (ja) 1975-01-10

Family

ID=33210294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1969034106U Expired JPS50674Y1 (ja) 1969-04-14 1969-04-14

Country Status (1)

Country Link
JP (1) JPS50674Y1 (ja)

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