JPS5066166A - - Google Patents

Info

Publication number
JPS5066166A
JPS5066166A JP11390873A JP11390873A JPS5066166A JP S5066166 A JPS5066166 A JP S5066166A JP 11390873 A JP11390873 A JP 11390873A JP 11390873 A JP11390873 A JP 11390873A JP S5066166 A JPS5066166 A JP S5066166A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11390873A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11390873A priority Critical patent/JPS5066166A/ja
Publication of JPS5066166A publication Critical patent/JPS5066166A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP11390873A 1973-10-12 1973-10-12 Pending JPS5066166A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11390873A JPS5066166A (ja) 1973-10-12 1973-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11390873A JPS5066166A (ja) 1973-10-12 1973-10-12

Publications (1)

Publication Number Publication Date
JPS5066166A true JPS5066166A (ja) 1975-06-04

Family

ID=14624179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11390873A Pending JPS5066166A (ja) 1973-10-12 1973-10-12

Country Status (1)

Country Link
JP (1) JPS5066166A (ja)

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