JPS5066165A - - Google Patents

Info

Publication number
JPS5066165A
JPS5066165A JP11389973A JP11389973A JPS5066165A JP S5066165 A JPS5066165 A JP S5066165A JP 11389973 A JP11389973 A JP 11389973A JP 11389973 A JP11389973 A JP 11389973A JP S5066165 A JPS5066165 A JP S5066165A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11389973A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11389973A priority Critical patent/JPS5066165A/ja
Publication of JPS5066165A publication Critical patent/JPS5066165A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP11389973A 1973-10-12 1973-10-12 Pending JPS5066165A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11389973A JPS5066165A (enrdf_load_stackoverflow) 1973-10-12 1973-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11389973A JPS5066165A (enrdf_load_stackoverflow) 1973-10-12 1973-10-12

Publications (1)

Publication Number Publication Date
JPS5066165A true JPS5066165A (enrdf_load_stackoverflow) 1975-06-04

Family

ID=14623930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11389973A Pending JPS5066165A (enrdf_load_stackoverflow) 1973-10-12 1973-10-12

Country Status (1)

Country Link
JP (1) JPS5066165A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258460U (enrdf_load_stackoverflow) * 1975-10-24 1977-04-27
JPH01297828A (ja) * 1988-05-25 1989-11-30 Matsushita Electron Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258460U (enrdf_load_stackoverflow) * 1975-10-24 1977-04-27
JPH01297828A (ja) * 1988-05-25 1989-11-30 Matsushita Electron Corp 半導体装置

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