JPS5066152U - - Google Patents
Info
- Publication number
- JPS5066152U JPS5066152U JP1973121063U JP12106373U JPS5066152U JP S5066152 U JPS5066152 U JP S5066152U JP 1973121063 U JP1973121063 U JP 1973121063U JP 12106373 U JP12106373 U JP 12106373U JP S5066152 U JPS5066152 U JP S5066152U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973121063U JPS5066152U (ja) | 1973-10-18 | 1973-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973121063U JPS5066152U (ja) | 1973-10-18 | 1973-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5066152U true JPS5066152U (ja) | 1975-06-14 |
Family
ID=28363458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973121063U Pending JPS5066152U (ja) | 1973-10-18 | 1973-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5066152U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS459249Y1 (ja) * | 1966-10-29 | 1970-04-30 |
-
1973
- 1973-10-18 JP JP1973121063U patent/JPS5066152U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS459249Y1 (ja) * | 1966-10-29 | 1970-04-30 |