JPS5065450A - - Google Patents
Info
- Publication number
- JPS5065450A JPS5065450A JP11470173A JP11470173A JPS5065450A JP S5065450 A JPS5065450 A JP S5065450A JP 11470173 A JP11470173 A JP 11470173A JP 11470173 A JP11470173 A JP 11470173A JP S5065450 A JPS5065450 A JP S5065450A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11470173A JPS5065450A (ja) | 1973-10-15 | 1973-10-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11470173A JPS5065450A (ja) | 1973-10-15 | 1973-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5065450A true JPS5065450A (ja) | 1975-06-03 |
Family
ID=14644448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11470173A Pending JPS5065450A (ja) | 1973-10-15 | 1973-10-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5065450A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56500606A (ja) * | 1979-06-06 | 1981-05-07 | ||
US7446542B2 (en) | 2005-03-04 | 2008-11-04 | Omniprobe, Inc. | Apparatus and method for automated stress testing of flip-chip packages |
-
1973
- 1973-10-15 JP JP11470173A patent/JPS5065450A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56500606A (ja) * | 1979-06-06 | 1981-05-07 | ||
US7446542B2 (en) | 2005-03-04 | 2008-11-04 | Omniprobe, Inc. | Apparatus and method for automated stress testing of flip-chip packages |