JPS506272B1 - - Google Patents
Info
- Publication number
- JPS506272B1 JPS506272B1 JP3137970A JP3137970A JPS506272B1 JP S506272 B1 JPS506272 B1 JP S506272B1 JP 3137970 A JP3137970 A JP 3137970A JP 3137970 A JP3137970 A JP 3137970A JP S506272 B1 JPS506272 B1 JP S506272B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3137970A JPS506272B1 (en:Method) | 1970-04-13 | 1970-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3137970A JPS506272B1 (en:Method) | 1970-04-13 | 1970-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS506272B1 true JPS506272B1 (en:Method) | 1975-03-12 |
Family
ID=12329605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3137970A Pending JPS506272B1 (en:Method) | 1970-04-13 | 1970-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS506272B1 (en:Method) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53159368U (en:Method) * | 1977-05-20 | 1978-12-13 | ||
| JPS54126675U (en:Method) * | 1978-02-24 | 1979-09-04 | ||
| CN109702639A (zh) * | 2019-01-02 | 2019-05-03 | 山东天岳先进材料科技有限公司 | 一种SiC单晶片磨抛方法 |
| JP2019214006A (ja) * | 2018-06-11 | 2019-12-19 | 株式会社ディスコ | 分級装置 |
-
1970
- 1970-04-13 JP JP3137970A patent/JPS506272B1/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53159368U (en:Method) * | 1977-05-20 | 1978-12-13 | ||
| JPS54126675U (en:Method) * | 1978-02-24 | 1979-09-04 | ||
| JP2019214006A (ja) * | 2018-06-11 | 2019-12-19 | 株式会社ディスコ | 分級装置 |
| CN109702639A (zh) * | 2019-01-02 | 2019-05-03 | 山东天岳先进材料科技有限公司 | 一种SiC单晶片磨抛方法 |