JPS506141B1 - - Google Patents

Info

Publication number
JPS506141B1
JPS506141B1 JP45071661A JP7166170A JPS506141B1 JP S506141 B1 JPS506141 B1 JP S506141B1 JP 45071661 A JP45071661 A JP 45071661A JP 7166170 A JP7166170 A JP 7166170A JP S506141 B1 JPS506141 B1 JP S506141B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45071661A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45071661A priority Critical patent/JPS506141B1/ja
Publication of JPS506141B1 publication Critical patent/JPS506141B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Bipolar Transistors (AREA)
JP45071661A 1970-08-15 1970-08-15 Pending JPS506141B1 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP45071661A JPS506141B1 (enExample) 1970-08-15 1970-08-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45071661A JPS506141B1 (enExample) 1970-08-15 1970-08-15

Publications (1)

Publication Number Publication Date
JPS506141B1 true JPS506141B1 (enExample) 1975-03-11

Family

ID=13466997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45071661A Pending JPS506141B1 (enExample) 1970-08-15 1970-08-15

Country Status (1)

Country Link
JP (1) JPS506141B1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151662U (enExample) * 1976-05-14 1977-11-17
JPS52138347A (en) * 1976-05-14 1977-11-18 Sanki Eng Co Ltd Method of conditioning air by changing speed of air
JPS5367946A (en) * 1976-11-30 1978-06-16 Sanki Eng Co Ltd Blow-off device for variable blowing speed air conditioning apparatus
JPS53123545A (en) * 1977-04-04 1978-10-28 Sanki Eng Co Ltd Variable wind velocity air conditioning device
JPH09273765A (ja) * 1996-04-04 1997-10-21 Shinkiyou Kensetsu:Kk 暖房リサイクル装置および暖房リサイクル方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151662U (enExample) * 1976-05-14 1977-11-17
JPS52138347A (en) * 1976-05-14 1977-11-18 Sanki Eng Co Ltd Method of conditioning air by changing speed of air
JPS5367946A (en) * 1976-11-30 1978-06-16 Sanki Eng Co Ltd Blow-off device for variable blowing speed air conditioning apparatus
JPS53123545A (en) * 1977-04-04 1978-10-28 Sanki Eng Co Ltd Variable wind velocity air conditioning device
JPH09273765A (ja) * 1996-04-04 1997-10-21 Shinkiyou Kensetsu:Kk 暖房リサイクル装置および暖房リサイクル方法

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