JPS505988B1 - - Google Patents
Info
- Publication number
- JPS505988B1 JPS505988B1 JP45024255A JP2425570A JPS505988B1 JP S505988 B1 JPS505988 B1 JP S505988B1 JP 45024255 A JP45024255 A JP 45024255A JP 2425570 A JP2425570 A JP 2425570A JP S505988 B1 JPS505988 B1 JP S505988B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Water Treatment By Electricity Or Magnetism (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45024255A JPS505988B1 (en) | 1970-03-23 | 1970-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45024255A JPS505988B1 (en) | 1970-03-23 | 1970-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS505988B1 true JPS505988B1 (en) | 1975-03-10 |
Family
ID=12133120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45024255A Pending JPS505988B1 (en) | 1970-03-23 | 1970-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS505988B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004011699A1 (en) * | 2002-07-31 | 2004-02-05 | Outokumpu Oyj | Removing surface oxides from copper |
| US20130092548A1 (en) * | 2011-10-18 | 2013-04-18 | Ming Jen Tzou | Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards |
-
1970
- 1970-03-23 JP JP45024255A patent/JPS505988B1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004011699A1 (en) * | 2002-07-31 | 2004-02-05 | Outokumpu Oyj | Removing surface oxides from copper |
| US20130092548A1 (en) * | 2011-10-18 | 2013-04-18 | Ming Jen Tzou | Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards |
| US9115441B2 (en) * | 2011-10-18 | 2015-08-25 | Nan Ya Plastics Corporation | Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards |