JPS5059499A - - Google Patents
Info
- Publication number
- JPS5059499A JPS5059499A JP48107474A JP10747473A JPS5059499A JP S5059499 A JPS5059499 A JP S5059499A JP 48107474 A JP48107474 A JP 48107474A JP 10747473 A JP10747473 A JP 10747473A JP S5059499 A JPS5059499 A JP S5059499A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10747473A JPS5331197B2 (enrdf_load_stackoverflow) | 1973-09-26 | 1973-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10747473A JPS5331197B2 (enrdf_load_stackoverflow) | 1973-09-26 | 1973-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5059499A true JPS5059499A (enrdf_load_stackoverflow) | 1975-05-22 |
| JPS5331197B2 JPS5331197B2 (enrdf_load_stackoverflow) | 1978-08-31 |
Family
ID=14460105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10747473A Expired JPS5331197B2 (enrdf_load_stackoverflow) | 1973-09-26 | 1973-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5331197B2 (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53123498A (en) * | 1977-04-01 | 1978-10-27 | Mitsubishi Electric Corp | Thermosetting resin composition |
| JPH01161737A (ja) * | 1987-12-17 | 1989-06-26 | Nitto Denko Corp | 光半導体装置 |
| US5017258A (en) * | 1986-06-20 | 1991-05-21 | Shell Oil Company | Pipe rehabilitation using epoxy resin composition |
| US6225377B1 (en) | 1992-07-17 | 2001-05-01 | Siemens Aktiengesellschaft | Blending epoxy resin-polyisocyanate-filler mixture and phenolic resin-filler mixture for molding |
-
1973
- 1973-09-26 JP JP10747473A patent/JPS5331197B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53123498A (en) * | 1977-04-01 | 1978-10-27 | Mitsubishi Electric Corp | Thermosetting resin composition |
| US5017258A (en) * | 1986-06-20 | 1991-05-21 | Shell Oil Company | Pipe rehabilitation using epoxy resin composition |
| JPH01161737A (ja) * | 1987-12-17 | 1989-06-26 | Nitto Denko Corp | 光半導体装置 |
| US6225377B1 (en) | 1992-07-17 | 2001-05-01 | Siemens Aktiengesellschaft | Blending epoxy resin-polyisocyanate-filler mixture and phenolic resin-filler mixture for molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5331197B2 (enrdf_load_stackoverflow) | 1978-08-31 |