JPS5057388A - - Google Patents
Info
- Publication number
- JPS5057388A JPS5057388A JP10571573A JP10571573A JPS5057388A JP S5057388 A JPS5057388 A JP S5057388A JP 10571573 A JP10571573 A JP 10571573A JP 10571573 A JP10571573 A JP 10571573A JP S5057388 A JPS5057388 A JP S5057388A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
Landscapes
- Wire Bonding (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48105715A JPS5910075B2 (ja) | 1973-09-19 | 1973-09-19 | 電界効果型トランジスタ |
| US05/506,872 US3946428A (en) | 1973-09-19 | 1974-09-17 | Encapsulation package for a semiconductor element |
| FR7431590A FR2244264B1 (US20110009641A1-20110113-C00185.png) | 1973-09-19 | 1974-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48105715A JPS5910075B2 (ja) | 1973-09-19 | 1973-09-19 | 電界効果型トランジスタ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56124870A Division JPS5756953A (en) | 1981-08-10 | 1981-08-10 | Transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5057388A true JPS5057388A (US20110009641A1-20110113-C00185.png) | 1975-05-19 |
| JPS5910075B2 JPS5910075B2 (ja) | 1984-03-06 |
Family
ID=14415017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48105715A Expired JPS5910075B2 (ja) | 1973-09-19 | 1973-09-19 | 電界効果型トランジスタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910075B2 (US20110009641A1-20110113-C00185.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50155973A (US20110009641A1-20110113-C00185.png) * | 1974-06-07 | 1975-12-16 | ||
| JPS6116554A (ja) * | 1984-07-03 | 1986-01-24 | Sony Corp | 半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4849951U (US20110009641A1-20110113-C00185.png) * | 1971-10-11 | 1973-06-30 | ||
| JPS49115651A (US20110009641A1-20110113-C00185.png) * | 1973-03-07 | 1974-11-05 |
-
1973
- 1973-09-19 JP JP48105715A patent/JPS5910075B2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4849951U (US20110009641A1-20110113-C00185.png) * | 1971-10-11 | 1973-06-30 | ||
| JPS49115651A (US20110009641A1-20110113-C00185.png) * | 1973-03-07 | 1974-11-05 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50155973A (US20110009641A1-20110113-C00185.png) * | 1974-06-07 | 1975-12-16 | ||
| JPS5836500B2 (ja) * | 1974-06-07 | 1983-08-09 | 株式会社日立製作所 | Ｉｃ用セラミック基板の製造法 |
| JPS6116554A (ja) * | 1984-07-03 | 1986-01-24 | Sony Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5910075B2 (ja) | 1984-03-06 |
