JPS5057384A - - Google Patents

Info

Publication number
JPS5057384A
JPS5057384A JP10564673A JP10564673A JPS5057384A JP S5057384 A JPS5057384 A JP S5057384A JP 10564673 A JP10564673 A JP 10564673A JP 10564673 A JP10564673 A JP 10564673A JP S5057384 A JPS5057384 A JP S5057384A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10564673A
Other versions
JPS5716741B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10564673A priority Critical patent/JPS5716741B2/ja
Publication of JPS5057384A publication Critical patent/JPS5057384A/ja
Publication of JPS5716741B2 publication Critical patent/JPS5716741B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP10564673A 1973-09-18 1973-09-18 Expired JPS5716741B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10564673A JPS5716741B2 (ja) 1973-09-18 1973-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10564673A JPS5716741B2 (ja) 1973-09-18 1973-09-18

Publications (2)

Publication Number Publication Date
JPS5057384A true JPS5057384A (ja) 1975-05-19
JPS5716741B2 JPS5716741B2 (ja) 1982-04-07

Family

ID=14413204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10564673A Expired JPS5716741B2 (ja) 1973-09-18 1973-09-18

Country Status (1)

Country Link
JP (1) JPS5716741B2 (ja)

Also Published As

Publication number Publication date
JPS5716741B2 (ja) 1982-04-07

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