JPS5057050A - - Google Patents

Info

Publication number
JPS5057050A
JPS5057050A JP49095464A JP9546474A JPS5057050A JP S5057050 A JPS5057050 A JP S5057050A JP 49095464 A JP49095464 A JP 49095464A JP 9546474 A JP9546474 A JP 9546474A JP S5057050 A JPS5057050 A JP S5057050A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49095464A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5057050A publication Critical patent/JPS5057050A/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0661Oscillating baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/32Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor using vibratory energy applied to the bath or substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
JP49095464A 1973-09-20 1974-08-20 Pending JPS5057050A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00398946A US3822820A (en) 1973-09-20 1973-09-20 Sonic agitation of molten metal

Publications (1)

Publication Number Publication Date
JPS5057050A true JPS5057050A (xx) 1975-05-19

Family

ID=23577458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49095464A Pending JPS5057050A (xx) 1973-09-20 1974-08-20

Country Status (9)

Country Link
US (1) US3822820A (xx)
JP (1) JPS5057050A (xx)
AT (1) AT335254B (xx)
AU (1) AU472477B2 (xx)
BR (1) BR7406824D0 (xx)
DE (1) DE2439380B2 (xx)
GB (1) GB1465097A (xx)
IT (1) IT1018853B (xx)
NL (1) NL7411123A (xx)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124170A (en) * 1976-04-13 1977-10-18 Standard Kogyo Kk Method of soldering printed circuit board and soldering tank
JP2007118046A (ja) * 2005-10-28 2007-05-17 Toyota Motor Corp ハンダ塗布装置およびハンダ塗布方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4071179A (en) * 1975-10-31 1978-01-31 Blackstone Corporation Apparatus and methods for fluxless soldering
US9598642B2 (en) * 2013-10-04 2017-03-21 Baker Hughes Incorporated Distributive temperature monitoring using magnetostrictive probe technology
CN104551289A (zh) * 2015-01-20 2015-04-29 武汉理工大学 一种异频多触点超声波辅助钎焊方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3249281A (en) * 1964-01-13 1966-05-03 Sanders Associates Inc Multiple ultrasonic solder fountain machine
US3752381A (en) * 1972-03-17 1973-08-14 Branson Instr Ultrasonic soldering apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124170A (en) * 1976-04-13 1977-10-18 Standard Kogyo Kk Method of soldering printed circuit board and soldering tank
JP2007118046A (ja) * 2005-10-28 2007-05-17 Toyota Motor Corp ハンダ塗布装置およびハンダ塗布方法
JP4635825B2 (ja) * 2005-10-28 2011-02-23 トヨタ自動車株式会社 ハンダ塗布装置およびハンダ塗布方法

Also Published As

Publication number Publication date
AU7120374A (en) 1976-01-15
IT1018853B (it) 1977-10-20
AU472477B2 (en) 1976-05-27
GB1465097A (en) 1977-02-23
BR7406824D0 (pt) 1975-09-23
DE2439380B2 (de) 1976-04-29
NL7411123A (nl) 1975-03-24
DE2439380A1 (de) 1975-04-03
AT335254B (de) 1977-03-10
US3822820A (en) 1974-07-09
ATA679874A (de) 1976-06-15

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