JPS5056199A - - Google Patents
Info
- Publication number
- JPS5056199A JPS5056199A JP10306573A JP10306573A JPS5056199A JP S5056199 A JPS5056199 A JP S5056199A JP 10306573 A JP10306573 A JP 10306573A JP 10306573 A JP10306573 A JP 10306573A JP S5056199 A JPS5056199 A JP S5056199A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10306573A JPS5056199A (US07582779-20090901-C00044.png) | 1973-09-14 | 1973-09-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10306573A JPS5056199A (US07582779-20090901-C00044.png) | 1973-09-14 | 1973-09-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5056199A true JPS5056199A (US07582779-20090901-C00044.png) | 1975-05-16 |
Family
ID=14344256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10306573A Pending JPS5056199A (US07582779-20090901-C00044.png) | 1973-09-14 | 1973-09-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5056199A (US07582779-20090901-C00044.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54103761U (US07582779-20090901-C00044.png) * | 1977-12-30 | 1979-07-21 | ||
JPS62139367A (ja) * | 1985-12-13 | 1987-06-23 | Oki Electric Ind Co Ltd | 発光ダイオ−ド |
JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
JPH0341954U (US07582779-20090901-C00044.png) * | 1989-09-01 | 1991-04-22 |
-
1973
- 1973-09-14 JP JP10306573A patent/JPS5056199A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54103761U (US07582779-20090901-C00044.png) * | 1977-12-30 | 1979-07-21 | ||
JPS5915509Y2 (ja) * | 1977-12-30 | 1984-05-08 | ロ−ム株式会社 | 発光表示装置 |
JPS62139367A (ja) * | 1985-12-13 | 1987-06-23 | Oki Electric Ind Co Ltd | 発光ダイオ−ド |
JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
JPH0341954U (US07582779-20090901-C00044.png) * | 1989-09-01 | 1991-04-22 |