JPS5056163A - - Google Patents
Info
- Publication number
- JPS5056163A JPS5056163A JP48103055A JP10305573A JPS5056163A JP S5056163 A JPS5056163 A JP S5056163A JP 48103055 A JP48103055 A JP 48103055A JP 10305573 A JP10305573 A JP 10305573A JP S5056163 A JPS5056163 A JP S5056163A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W72/073—
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- H10W72/325—
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- H10W72/351—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48103055A JPS5056163A (ja) | 1973-09-14 | 1973-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48103055A JPS5056163A (ja) | 1973-09-14 | 1973-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5056163A true JPS5056163A (ja) | 1975-05-16 |
Family
ID=14343973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48103055A Pending JPS5056163A (ja) | 1973-09-14 | 1973-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5056163A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015053379A (ja) * | 2013-09-06 | 2015-03-19 | トヨタ自動車株式会社 | 半導体装置、及び半導体装置の製造方法 |
| EP3890008A1 (en) * | 2020-03-31 | 2021-10-06 | Mitsubishi Electric R&D Centre Europe B.V. | Semiconductor module assembly comprising a joint layer with an elastic grid between a semiconductor die and a substrate and manufacturing process of such assembly |
-
1973
- 1973-09-14 JP JP48103055A patent/JPS5056163A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015053379A (ja) * | 2013-09-06 | 2015-03-19 | トヨタ自動車株式会社 | 半導体装置、及び半導体装置の製造方法 |
| EP3890008A1 (en) * | 2020-03-31 | 2021-10-06 | Mitsubishi Electric R&D Centre Europe B.V. | Semiconductor module assembly comprising a joint layer with an elastic grid between a semiconductor die and a substrate and manufacturing process of such assembly |
| WO2021199553A1 (en) * | 2020-03-31 | 2021-10-07 | Mitsubishi Electric Corporation | Power module assembly, process for manufacturing power module assembly, and power module |