JPS505565U - - Google Patents
Info
- Publication number
- JPS505565U JPS505565U JP1973058879U JP5887973U JPS505565U JP S505565 U JPS505565 U JP S505565U JP 1973058879 U JP1973058879 U JP 1973058879U JP 5887973 U JP5887973 U JP 5887973U JP S505565 U JPS505565 U JP S505565U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973058879U JPS5636135Y2 (pl) | 1973-05-18 | 1973-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973058879U JPS5636135Y2 (pl) | 1973-05-18 | 1973-05-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS505565U true JPS505565U (pl) | 1975-01-21 |
| JPS5636135Y2 JPS5636135Y2 (pl) | 1981-08-25 |
Family
ID=28216950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973058879U Expired JPS5636135Y2 (pl) | 1973-05-18 | 1973-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5636135Y2 (pl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243069U (pl) * | 1975-09-23 | 1977-03-26 | ||
| JPS5433061U (pl) * | 1977-08-10 | 1979-03-03 |
-
1973
- 1973-05-18 JP JP1973058879U patent/JPS5636135Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243069U (pl) * | 1975-09-23 | 1977-03-26 | ||
| JPS5433061U (pl) * | 1977-08-10 | 1979-03-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5636135Y2 (pl) | 1981-08-25 |