JPS5054286A - - Google Patents

Info

Publication number
JPS5054286A
JPS5054286A JP48102326A JP10232673A JPS5054286A JP S5054286 A JPS5054286 A JP S5054286A JP 48102326 A JP48102326 A JP 48102326A JP 10232673 A JP10232673 A JP 10232673A JP S5054286 A JPS5054286 A JP S5054286A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48102326A
Other languages
Japanese (ja)
Other versions
JPS5713141B2 (fa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10232673A priority Critical patent/JPS5713141B2/ja
Publication of JPS5054286A publication Critical patent/JPS5054286A/ja
Publication of JPS5713141B2 publication Critical patent/JPS5713141B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10232673A 1973-09-10 1973-09-10 Expired JPS5713141B2 (fa)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10232673A JPS5713141B2 (fa) 1973-09-10 1973-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10232673A JPS5713141B2 (fa) 1973-09-10 1973-09-10

Publications (2)

Publication Number Publication Date
JPS5054286A true JPS5054286A (fa) 1975-05-13
JPS5713141B2 JPS5713141B2 (fa) 1982-03-15

Family

ID=14324411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10232673A Expired JPS5713141B2 (fa) 1973-09-10 1973-09-10

Country Status (1)

Country Link
JP (1) JPS5713141B2 (fa)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157240A (en) * 1979-05-25 1980-12-06 Nec Corp Semiconductor device
JPS5936945A (ja) * 1982-08-24 1984-02-29 Mitsubishi Electric Corp 半導体装置の入力接続端子

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6610019B2 (ja) 2015-06-16 2019-11-27 ソニー株式会社 受信装置、送信装置、及び、データ処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157240A (en) * 1979-05-25 1980-12-06 Nec Corp Semiconductor device
JPS5936945A (ja) * 1982-08-24 1984-02-29 Mitsubishi Electric Corp 半導体装置の入力接続端子

Also Published As

Publication number Publication date
JPS5713141B2 (fa) 1982-03-15

Similar Documents

Publication Publication Date Title
AU476761B2 (fa)
AU474593B2 (fa)
AU474511B2 (fa)
AU474838B2 (fa)
AU465453B2 (fa)
AU471343B2 (fa)
AU476714B2 (fa)
AU466283B2 (fa)
AU472848B2 (fa)
AU476696B2 (fa)
JPS5054286A (fa)
AU477823B2 (fa)
AU471461B2 (fa)
AU476873B1 (fa)
AU477824B2 (fa)
AR200885A1 (fa)
AU5382473A (fa)
CH41973A4 (fa)
AU479404A (fa)
BG18729A1 (fa)
BG18244A1 (fa)
BG19465A1 (fa)
AU479562A (fa)
AU479539A (fa)
AU479522A (fa)