JPS5052869U - - Google Patents

Info

Publication number
JPS5052869U
JPS5052869U JP1973106995U JP10699573U JPS5052869U JP S5052869 U JPS5052869 U JP S5052869U JP 1973106995 U JP1973106995 U JP 1973106995U JP 10699573 U JP10699573 U JP 10699573U JP S5052869 U JPS5052869 U JP S5052869U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1973106995U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973106995U priority Critical patent/JPS5052869U/ja
Publication of JPS5052869U publication Critical patent/JPS5052869U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1973106995U 1973-09-11 1973-09-11 Pending JPS5052869U (show.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973106995U JPS5052869U (show.php) 1973-09-11 1973-09-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973106995U JPS5052869U (show.php) 1973-09-11 1973-09-11

Publications (1)

Publication Number Publication Date
JPS5052869U true JPS5052869U (show.php) 1975-05-21

Family

ID=28323997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973106995U Pending JPS5052869U (show.php) 1973-09-11 1973-09-11

Country Status (1)

Country Link
JP (1) JPS5052869U (show.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS521065U (show.php) * 1975-06-23 1977-01-06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS521065U (show.php) * 1975-06-23 1977-01-06

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