JPS5052868U - - Google Patents

Info

Publication number
JPS5052868U
JPS5052868U JP1973105848U JP10584873U JPS5052868U JP S5052868 U JPS5052868 U JP S5052868U JP 1973105848 U JP1973105848 U JP 1973105848U JP 10584873 U JP10584873 U JP 10584873U JP S5052868 U JPS5052868 U JP S5052868U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1973105848U
Other languages
Japanese (ja)
Other versions
JPS5417344Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973105848U priority Critical patent/JPS5417344Y2/ja
Publication of JPS5052868U publication Critical patent/JPS5052868U/ja
Application granted granted Critical
Publication of JPS5417344Y2 publication Critical patent/JPS5417344Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1973105848U 1973-09-10 1973-09-10 Expired JPS5417344Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973105848U JPS5417344Y2 (enExample) 1973-09-10 1973-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973105848U JPS5417344Y2 (enExample) 1973-09-10 1973-09-10

Publications (2)

Publication Number Publication Date
JPS5052868U true JPS5052868U (enExample) 1975-05-21
JPS5417344Y2 JPS5417344Y2 (enExample) 1979-07-04

Family

ID=28320778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973105848U Expired JPS5417344Y2 (enExample) 1973-09-10 1973-09-10

Country Status (1)

Country Link
JP (1) JPS5417344Y2 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316278U (enExample) * 1976-07-23 1978-02-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316278U (enExample) * 1976-07-23 1978-02-10

Also Published As

Publication number Publication date
JPS5417344Y2 (enExample) 1979-07-04

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