JPS5050864A - - Google Patents
Info
- Publication number
- JPS5050864A JPS5050864A JP9920973A JP9920973A JPS5050864A JP S5050864 A JPS5050864 A JP S5050864A JP 9920973 A JP9920973 A JP 9920973A JP 9920973 A JP9920973 A JP 9920973A JP S5050864 A JPS5050864 A JP S5050864A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Warehouses Or Storage Devices (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9920973A JPS5652446B2 (cg-RX-API-DMAC7.html) | 1973-09-05 | 1973-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9920973A JPS5652446B2 (cg-RX-API-DMAC7.html) | 1973-09-05 | 1973-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5050864A true JPS5050864A (cg-RX-API-DMAC7.html) | 1975-05-07 |
| JPS5652446B2 JPS5652446B2 (cg-RX-API-DMAC7.html) | 1981-12-12 |
Family
ID=14241248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9920973A Expired JPS5652446B2 (cg-RX-API-DMAC7.html) | 1973-09-05 | 1973-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5652446B2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7151197B2 (en) | 2001-09-28 | 2006-12-19 | Great Lakes Chemical Corporation | Processes for purifying chlorofluorinated compounds and processes for purifying CF3CFHCF3 |
| US7216722B2 (en) | 2003-04-17 | 2007-05-15 | Great Lakes Chemical Corporation | Fire extinguishing mixtures, methods and systems |
-
1973
- 1973-09-05 JP JP9920973A patent/JPS5652446B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7151197B2 (en) | 2001-09-28 | 2006-12-19 | Great Lakes Chemical Corporation | Processes for purifying chlorofluorinated compounds and processes for purifying CF3CFHCF3 |
| US7335805B2 (en) | 2001-09-28 | 2008-02-26 | Great Lakes Chemical Corporation | Processes for purifying reaction products and processes for separating chlorofluorinated compounds |
| US7216722B2 (en) | 2003-04-17 | 2007-05-15 | Great Lakes Chemical Corporation | Fire extinguishing mixtures, methods and systems |
| US7223351B2 (en) | 2003-04-17 | 2007-05-29 | Great Lakes Chemical Corporation | Fire extinguishing mixtures, methods and systems |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5652446B2 (cg-RX-API-DMAC7.html) | 1981-12-12 |