JPS5048549U - - Google Patents

Info

Publication number
JPS5048549U
JPS5048549U JP1973101578U JP10157873U JPS5048549U JP S5048549 U JPS5048549 U JP S5048549U JP 1973101578 U JP1973101578 U JP 1973101578U JP 10157873 U JP10157873 U JP 10157873U JP S5048549 U JPS5048549 U JP S5048549U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1973101578U
Other languages
Japanese (ja)
Other versions
JPS5433426Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973101578U priority Critical patent/JPS5433426Y2/ja
Publication of JPS5048549U publication Critical patent/JPS5048549U/ja
Application granted granted Critical
Publication of JPS5433426Y2 publication Critical patent/JPS5433426Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281Auxiliary members
    • H10W72/283Reinforcing structures, e.g. bump collars

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Static Random-Access Memory (AREA)
  • Wire Bonding (AREA)
JP1973101578U 1973-08-31 1973-08-31 Expired JPS5433426Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973101578U JPS5433426Y2 (https=) 1973-08-31 1973-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973101578U JPS5433426Y2 (https=) 1973-08-31 1973-08-31

Publications (2)

Publication Number Publication Date
JPS5048549U true JPS5048549U (https=) 1975-05-13
JPS5433426Y2 JPS5433426Y2 (https=) 1979-10-15

Family

ID=28308801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973101578U Expired JPS5433426Y2 (https=) 1973-08-31 1973-08-31

Country Status (1)

Country Link
JP (1) JPS5433426Y2 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931286A (https=) * 1972-02-26 1974-03-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931286A (https=) * 1972-02-26 1974-03-20

Also Published As

Publication number Publication date
JPS5433426Y2 (https=) 1979-10-15

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