JPS5048547U - - Google Patents
Info
- Publication number
- JPS5048547U JPS5048547U JP1973102224U JP10222473U JPS5048547U JP S5048547 U JPS5048547 U JP S5048547U JP 1973102224 U JP1973102224 U JP 1973102224U JP 10222473 U JP10222473 U JP 10222473U JP S5048547 U JPS5048547 U JP S5048547U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973102224U JPS5048547U (ja) | 1973-08-31 | 1973-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973102224U JPS5048547U (ja) | 1973-08-31 | 1973-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5048547U true JPS5048547U (ja) | 1975-05-13 |
Family
ID=28310609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973102224U Pending JPS5048547U (ja) | 1973-08-31 | 1973-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5048547U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58170038A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | 半導体パツケ−ジ |
-
1973
- 1973-08-31 JP JP1973102224U patent/JPS5048547U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58170038A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | 半導体パツケ−ジ |