JPS5046076A - - Google Patents

Info

Publication number
JPS5046076A
JPS5046076A JP48095685A JP9568573A JPS5046076A JP S5046076 A JPS5046076 A JP S5046076A JP 48095685 A JP48095685 A JP 48095685A JP 9568573 A JP9568573 A JP 9568573A JP S5046076 A JPS5046076 A JP S5046076A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48095685A
Other languages
Japanese (ja)
Other versions
JPS5631751B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9568573A priority Critical patent/JPS5631751B2/ja
Publication of JPS5046076A publication Critical patent/JPS5046076A/ja
Publication of JPS5631751B2 publication Critical patent/JPS5631751B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP9568573A 1973-08-28 1973-08-28 Expired JPS5631751B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9568573A JPS5631751B2 (enrdf_load_stackoverflow) 1973-08-28 1973-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9568573A JPS5631751B2 (enrdf_load_stackoverflow) 1973-08-28 1973-08-28

Publications (2)

Publication Number Publication Date
JPS5046076A true JPS5046076A (enrdf_load_stackoverflow) 1975-04-24
JPS5631751B2 JPS5631751B2 (enrdf_load_stackoverflow) 1981-07-23

Family

ID=14144331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9568573A Expired JPS5631751B2 (enrdf_load_stackoverflow) 1973-08-28 1973-08-28

Country Status (1)

Country Link
JP (1) JPS5631751B2 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5356978A (en) * 1976-10-29 1978-05-23 Western Electric Co High power microstructure gallium arsenide schottky barrier fet transistor device and method of producing same
JPS53134668U (enrdf_load_stackoverflow) * 1977-03-30 1978-10-25
JPS55101064U (enrdf_load_stackoverflow) * 1979-01-10 1980-07-14
JPS6276568A (ja) * 1985-09-28 1987-04-08 Sharp Corp 電界効果トランジスタ
JP2011249821A (ja) * 2011-07-12 2011-12-08 Renesas Electronics Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513136A (en) * 1978-07-17 1980-01-30 Tdk Corp Liquid atomizer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513136A (en) * 1978-07-17 1980-01-30 Tdk Corp Liquid atomizer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5356978A (en) * 1976-10-29 1978-05-23 Western Electric Co High power microstructure gallium arsenide schottky barrier fet transistor device and method of producing same
JPS53134668U (enrdf_load_stackoverflow) * 1977-03-30 1978-10-25
JPS55101064U (enrdf_load_stackoverflow) * 1979-01-10 1980-07-14
JPS6276568A (ja) * 1985-09-28 1987-04-08 Sharp Corp 電界効果トランジスタ
JP2011249821A (ja) * 2011-07-12 2011-12-08 Renesas Electronics Corp 半導体装置

Also Published As

Publication number Publication date
JPS5631751B2 (enrdf_load_stackoverflow) 1981-07-23

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