JPS5046076A - - Google Patents

Info

Publication number
JPS5046076A
JPS5046076A JP48095685A JP9568573A JPS5046076A JP S5046076 A JPS5046076 A JP S5046076A JP 48095685 A JP48095685 A JP 48095685A JP 9568573 A JP9568573 A JP 9568573A JP S5046076 A JPS5046076 A JP S5046076A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48095685A
Other languages
Japanese (ja)
Other versions
JPS5631751B2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9568573A priority Critical patent/JPS5631751B2/ja
Publication of JPS5046076A publication Critical patent/JPS5046076A/ja
Publication of JPS5631751B2 publication Critical patent/JPS5631751B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
JP9568573A 1973-08-28 1973-08-28 Expired JPS5631751B2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9568573A JPS5631751B2 (cs) 1973-08-28 1973-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9568573A JPS5631751B2 (cs) 1973-08-28 1973-08-28

Publications (2)

Publication Number Publication Date
JPS5046076A true JPS5046076A (cs) 1975-04-24
JPS5631751B2 JPS5631751B2 (cs) 1981-07-23

Family

ID=14144331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9568573A Expired JPS5631751B2 (cs) 1973-08-28 1973-08-28

Country Status (1)

Country Link
JP (1) JPS5631751B2 (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5356978A (en) * 1976-10-29 1978-05-23 Western Electric Co High power microstructure gallium arsenide schottky barrier fet transistor device and method of producing same
JPS53134668U (cs) * 1977-03-30 1978-10-25
JPS55101064U (cs) * 1979-01-10 1980-07-14
JPS6276568A (ja) * 1985-09-28 1987-04-08 Sharp Corp 電界効果トランジスタ
JP2011249821A (ja) * 2011-07-12 2011-12-08 Renesas Electronics Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513136A (en) * 1978-07-17 1980-01-30 Tdk Corp Liquid atomizer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513136A (en) * 1978-07-17 1980-01-30 Tdk Corp Liquid atomizer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5356978A (en) * 1976-10-29 1978-05-23 Western Electric Co High power microstructure gallium arsenide schottky barrier fet transistor device and method of producing same
JPS53134668U (cs) * 1977-03-30 1978-10-25
JPS55101064U (cs) * 1979-01-10 1980-07-14
JPS6276568A (ja) * 1985-09-28 1987-04-08 Sharp Corp 電界効果トランジスタ
JP2011249821A (ja) * 2011-07-12 2011-12-08 Renesas Electronics Corp 半導体装置

Also Published As

Publication number Publication date
JPS5631751B2 (cs) 1981-07-23

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