JPS5044930A - - Google Patents
Info
- Publication number
- JPS5044930A JPS5044930A JP9439073A JP9439073A JPS5044930A JP S5044930 A JPS5044930 A JP S5044930A JP 9439073 A JP9439073 A JP 9439073A JP 9439073 A JP9439073 A JP 9439073A JP S5044930 A JPS5044930 A JP S5044930A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9439073A JPS5044930A (ko) | 1973-08-24 | 1973-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9439073A JPS5044930A (ko) | 1973-08-24 | 1973-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5044930A true JPS5044930A (ko) | 1975-04-22 |
Family
ID=14108940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9439073A Pending JPS5044930A (ko) | 1973-08-24 | 1973-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5044930A (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4715116A (en) * | 1983-12-19 | 1987-12-29 | M&T Chemicals Inc. | Production of dielectric boards |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| CN103409733A (zh) * | 2013-07-22 | 2013-11-27 | 深圳市乐百特新材料技术有限公司 | 一种镭射直接成型天线的金属化方法及其所用化学沉铜液 |
-
1973
- 1973-08-24 JP JP9439073A patent/JPS5044930A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4715116A (en) * | 1983-12-19 | 1987-12-29 | M&T Chemicals Inc. | Production of dielectric boards |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| CN103409733A (zh) * | 2013-07-22 | 2013-11-27 | 深圳市乐百特新材料技术有限公司 | 一种镭射直接成型天线的金属化方法及其所用化学沉铜液 |