JPS5040545Y2 - - Google Patents

Info

Publication number
JPS5040545Y2
JPS5040545Y2 JP1971048777U JP4877771U JPS5040545Y2 JP S5040545 Y2 JPS5040545 Y2 JP S5040545Y2 JP 1971048777 U JP1971048777 U JP 1971048777U JP 4877771 U JP4877771 U JP 4877771U JP S5040545 Y2 JPS5040545 Y2 JP S5040545Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1971048777U
Other languages
Japanese (ja)
Other versions
JPS488165U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971048777U priority Critical patent/JPS5040545Y2/ja
Publication of JPS488165U publication Critical patent/JPS488165U/ja
Application granted granted Critical
Publication of JPS5040545Y2 publication Critical patent/JPS5040545Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1971048777U 1971-06-09 1971-06-09 Expired JPS5040545Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971048777U JPS5040545Y2 (en:Method) 1971-06-09 1971-06-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971048777U JPS5040545Y2 (en:Method) 1971-06-09 1971-06-09

Publications (2)

Publication Number Publication Date
JPS488165U JPS488165U (en:Method) 1973-01-29
JPS5040545Y2 true JPS5040545Y2 (en:Method) 1975-11-19

Family

ID=27927218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971048777U Expired JPS5040545Y2 (en:Method) 1971-06-09 1971-06-09

Country Status (1)

Country Link
JP (1) JPS5040545Y2 (en:Method)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374304U (en:Method) * 1976-11-20 1978-06-21
JPS5639402Y2 (en:Method) * 1976-11-24 1981-09-14
JPH021119Y2 (en:Method) * 1980-11-25 1990-01-11
JPH021120Y2 (en:Method) * 1980-11-25 1990-01-11
JPH021117Y2 (en:Method) * 1980-11-25 1990-01-11
JPH021118Y2 (en:Method) * 1980-11-25 1990-01-11
JPS6391049U (en:Method) * 1986-12-01 1988-06-13

Also Published As

Publication number Publication date
JPS488165U (en:Method) 1973-01-29

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