JPS5040286A - - Google Patents

Info

Publication number
JPS5040286A
JPS5040286A JP48092123A JP9212373A JPS5040286A JP S5040286 A JPS5040286 A JP S5040286A JP 48092123 A JP48092123 A JP 48092123A JP 9212373 A JP9212373 A JP 9212373A JP S5040286 A JPS5040286 A JP S5040286A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48092123A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48092123A priority Critical patent/JPS5040286A/ja
Publication of JPS5040286A publication Critical patent/JPS5040286A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Wire Bonding (AREA)
JP48092123A 1973-08-16 1973-08-16 Pending JPS5040286A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48092123A JPS5040286A (ja) 1973-08-16 1973-08-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48092123A JPS5040286A (ja) 1973-08-16 1973-08-16

Publications (1)

Publication Number Publication Date
JPS5040286A true JPS5040286A (ja) 1975-04-12

Family

ID=14045643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48092123A Pending JPS5040286A (ja) 1973-08-16 1973-08-16

Country Status (1)

Country Link
JP (1) JPS5040286A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663504A (en) * 1983-04-11 1987-05-05 Raychem Corporation Load break switch

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663504A (en) * 1983-04-11 1987-05-05 Raychem Corporation Load break switch

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