JPS5040285A - - Google Patents

Info

Publication number
JPS5040285A
JPS5040285A JP48092000A JP9200073A JPS5040285A JP S5040285 A JPS5040285 A JP S5040285A JP 48092000 A JP48092000 A JP 48092000A JP 9200073 A JP9200073 A JP 9200073A JP S5040285 A JPS5040285 A JP S5040285A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48092000A
Other versions
JPS569019B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9200073A priority Critical patent/JPS569019B2/ja
Publication of JPS5040285A publication Critical patent/JPS5040285A/ja
Publication of JPS569019B2 publication Critical patent/JPS569019B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Wire Bonding (AREA)
JP9200073A 1973-08-15 1973-08-15 Expired JPS569019B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9200073A JPS569019B2 (ja) 1973-08-15 1973-08-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9200073A JPS569019B2 (ja) 1973-08-15 1973-08-15

Publications (2)

Publication Number Publication Date
JPS5040285A true JPS5040285A (ja) 1975-04-12
JPS569019B2 JPS569019B2 (ja) 1981-02-26

Family

ID=14042136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9200073A Expired JPS569019B2 (ja) 1973-08-15 1973-08-15

Country Status (1)

Country Link
JP (1) JPS569019B2 (ja)

Also Published As

Publication number Publication date
JPS569019B2 (ja) 1981-02-26

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