JPS5040164U - - Google Patents
Info
- Publication number
- JPS5040164U JPS5040164U JP1973093866U JP9386673U JPS5040164U JP S5040164 U JPS5040164 U JP S5040164U JP 1973093866 U JP1973093866 U JP 1973093866U JP 9386673 U JP9386673 U JP 9386673U JP S5040164 U JPS5040164 U JP S5040164U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973093866U JPS5239391Y2 (es) | 1973-08-09 | 1973-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973093866U JPS5239391Y2 (es) | 1973-08-09 | 1973-08-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5040164U true JPS5040164U (es) | 1975-04-24 |
| JPS5239391Y2 JPS5239391Y2 (es) | 1977-09-06 |
Family
ID=28287058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973093866U Expired JPS5239391Y2 (es) | 1973-08-09 | 1973-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5239391Y2 (es) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52170257U (es) * | 1976-06-18 | 1977-12-24 | ||
| JPS5996841U (ja) * | 1982-12-20 | 1984-06-30 | 三洋電機株式会社 | 混成集積回路の放熱構造 |
| JP6163246B1 (ja) * | 2016-12-06 | 2017-07-12 | 西村陶業株式会社 | セラミックス基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS482057U (es) * | 1971-05-27 | 1973-01-11 |
-
1973
- 1973-08-09 JP JP1973093866U patent/JPS5239391Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS482057U (es) * | 1971-05-27 | 1973-01-11 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52170257U (es) * | 1976-06-18 | 1977-12-24 | ||
| JPS5996841U (ja) * | 1982-12-20 | 1984-06-30 | 三洋電機株式会社 | 混成集積回路の放熱構造 |
| JP6163246B1 (ja) * | 2016-12-06 | 2017-07-12 | 西村陶業株式会社 | セラミックス基板の製造方法 |
| JP2018093100A (ja) * | 2016-12-06 | 2018-06-14 | 西村陶業株式会社 | セラミックス基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5239391Y2 (es) | 1977-09-06 |