JPS5040164U - - Google Patents

Info

Publication number
JPS5040164U
JPS5040164U JP1973093866U JP9386673U JPS5040164U JP S5040164 U JPS5040164 U JP S5040164U JP 1973093866 U JP1973093866 U JP 1973093866U JP 9386673 U JP9386673 U JP 9386673U JP S5040164 U JPS5040164 U JP S5040164U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1973093866U
Other languages
Japanese (ja)
Other versions
JPS5239391Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973093866U priority Critical patent/JPS5239391Y2/ja
Publication of JPS5040164U publication Critical patent/JPS5040164U/ja
Application granted granted Critical
Publication of JPS5239391Y2 publication Critical patent/JPS5239391Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1973093866U 1973-08-09 1973-08-09 Expired JPS5239391Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973093866U JPS5239391Y2 (enrdf_load_stackoverflow) 1973-08-09 1973-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973093866U JPS5239391Y2 (enrdf_load_stackoverflow) 1973-08-09 1973-08-09

Publications (2)

Publication Number Publication Date
JPS5040164U true JPS5040164U (enrdf_load_stackoverflow) 1975-04-24
JPS5239391Y2 JPS5239391Y2 (enrdf_load_stackoverflow) 1977-09-06

Family

ID=28287058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973093866U Expired JPS5239391Y2 (enrdf_load_stackoverflow) 1973-08-09 1973-08-09

Country Status (1)

Country Link
JP (1) JPS5239391Y2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52170257U (enrdf_load_stackoverflow) * 1976-06-18 1977-12-24
JPS5996841U (ja) * 1982-12-20 1984-06-30 三洋電機株式会社 混成集積回路の放熱構造
JP2018093100A (ja) * 2016-12-06 2018-06-14 西村陶業株式会社 セラミックス基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482057U (enrdf_load_stackoverflow) * 1971-05-27 1973-01-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482057U (enrdf_load_stackoverflow) * 1971-05-27 1973-01-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52170257U (enrdf_load_stackoverflow) * 1976-06-18 1977-12-24
JPS5996841U (ja) * 1982-12-20 1984-06-30 三洋電機株式会社 混成集積回路の放熱構造
JP2018093100A (ja) * 2016-12-06 2018-06-14 西村陶業株式会社 セラミックス基板の製造方法

Also Published As

Publication number Publication date
JPS5239391Y2 (enrdf_load_stackoverflow) 1977-09-06

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