JPS50398A - - Google Patents
Info
- Publication number
- JPS50398A JPS50398A JP2800174A JP2800174A JPS50398A JP S50398 A JPS50398 A JP S50398A JP 2800174 A JP2800174 A JP 2800174A JP 2800174 A JP2800174 A JP 2800174A JP S50398 A JPS50398 A JP S50398A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Treatment And Processing Of Natural Fur Or Leather (AREA)
- Paints Or Removers (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34020073A | 1973-03-12 | 1973-03-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50398A true JPS50398A (ja) | 1975-01-06 |
| JPS5719521B2 JPS5719521B2 (ja) | 1982-04-23 |
Family
ID=23332313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2800174A Expired JPS5719521B2 (ja) | 1973-03-12 | 1974-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5719521B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094788A (ja) * | 1983-10-28 | 1985-05-27 | 住友金属鉱山株式会社 | 厚膜ペ−スト用ビヒクル |
-
1974
- 1974-03-11 JP JP2800174A patent/JPS5719521B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094788A (ja) * | 1983-10-28 | 1985-05-27 | 住友金属鉱山株式会社 | 厚膜ペ−スト用ビヒクル |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5719521B2 (ja) | 1982-04-23 |