JPS5039852A - - Google Patents
Info
- Publication number
- JPS5039852A JPS5039852A JP9068473A JP9068473A JPS5039852A JP S5039852 A JPS5039852 A JP S5039852A JP 9068473 A JP9068473 A JP 9068473A JP 9068473 A JP9068473 A JP 9068473A JP S5039852 A JPS5039852 A JP S5039852A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Bipolar Transistors (AREA)
- Networks Using Active Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9068473A JPS5330478B2 (ja) | 1973-08-13 | 1973-08-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9068473A JPS5330478B2 (ja) | 1973-08-13 | 1973-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5039852A true JPS5039852A (ja) | 1975-04-12 |
| JPS5330478B2 JPS5330478B2 (ja) | 1978-08-26 |
Family
ID=14005348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9068473A Expired JPS5330478B2 (ja) | 1973-08-13 | 1973-08-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5330478B2 (ja) |
-
1973
- 1973-08-13 JP JP9068473A patent/JPS5330478B2/ja not_active Expired
Non-Patent Citations (1)
| Title |
|---|
| TOURNALOFSOLIDSTATECIRAUIT#N3=1969 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5330478B2 (ja) | 1978-08-26 |