JPS5038445U - - Google Patents

Info

Publication number
JPS5038445U
JPS5038445U JP1973093339U JP9333973U JPS5038445U JP S5038445 U JPS5038445 U JP S5038445U JP 1973093339 U JP1973093339 U JP 1973093339U JP 9333973 U JP9333973 U JP 9333973U JP S5038445 U JPS5038445 U JP S5038445U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1973093339U
Other versions
JPS5628784Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973093339U priority Critical patent/JPS5628784Y2/ja
Publication of JPS5038445U publication Critical patent/JPS5038445U/ja
Application granted granted Critical
Publication of JPS5628784Y2 publication Critical patent/JPS5628784Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1973093339U 1973-08-08 1973-08-08 Expired JPS5628784Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973093339U JPS5628784Y2 (ja) 1973-08-08 1973-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973093339U JPS5628784Y2 (ja) 1973-08-08 1973-08-08

Publications (2)

Publication Number Publication Date
JPS5038445U true JPS5038445U (ja) 1975-04-21
JPS5628784Y2 JPS5628784Y2 (ja) 1981-07-08

Family

ID=28285605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973093339U Expired JPS5628784Y2 (ja) 1973-08-08 1973-08-08

Country Status (1)

Country Link
JP (1) JPS5628784Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459296Y1 (ja) * 1967-01-09 1970-05-01
JPS459628Y1 (ja) * 1967-07-14 1970-05-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459296Y1 (ja) * 1967-01-09 1970-05-01
JPS459628Y1 (ja) * 1967-07-14 1970-05-06

Also Published As

Publication number Publication date
JPS5628784Y2 (ja) 1981-07-08

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