JPS5037386B1 - - Google Patents

Info

Publication number
JPS5037386B1
JPS5037386B1 JP45001301A JP130170A JPS5037386B1 JP S5037386 B1 JPS5037386 B1 JP S5037386B1 JP 45001301 A JP45001301 A JP 45001301A JP 130170 A JP130170 A JP 130170A JP S5037386 B1 JPS5037386 B1 JP S5037386B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45001301A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45001301A priority Critical patent/JPS5037386B1/ja
Publication of JPS5037386B1 publication Critical patent/JPS5037386B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP45001301A 1969-12-30 1969-12-30 Pending JPS5037386B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP45001301A JPS5037386B1 (ja) 1969-12-30 1969-12-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45001301A JPS5037386B1 (ja) 1969-12-30 1969-12-30

Publications (1)

Publication Number Publication Date
JPS5037386B1 true JPS5037386B1 (ja) 1975-12-02

Family

ID=11497636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45001301A Pending JPS5037386B1 (ja) 1969-12-30 1969-12-30

Country Status (1)

Country Link
JP (1) JPS5037386B1 (ja)

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