JPS5037357A - - Google Patents
Info
- Publication number
- JPS5037357A JPS5037357A JP48087528A JP8752873A JPS5037357A JP S5037357 A JPS5037357 A JP S5037357A JP 48087528 A JP48087528 A JP 48087528A JP 8752873 A JP8752873 A JP 8752873A JP S5037357 A JPS5037357 A JP S5037357A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48087528A JPS5037357A (enrdf_load_stackoverflow) | 1973-08-06 | 1973-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48087528A JPS5037357A (enrdf_load_stackoverflow) | 1973-08-06 | 1973-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5037357A true JPS5037357A (enrdf_load_stackoverflow) | 1975-04-08 |
Family
ID=13917484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48087528A Pending JPS5037357A (enrdf_load_stackoverflow) | 1973-08-06 | 1973-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5037357A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS527676A (en) * | 1975-07-08 | 1977-01-20 | Seiko Epson Corp | Semiconductor integrated circuit |
| JPS5379193A (en) * | 1976-12-23 | 1978-07-13 | Westinghouse Electric Corp | Lattice for nuclear fuel assembly |
-
1973
- 1973-08-06 JP JP48087528A patent/JPS5037357A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS527676A (en) * | 1975-07-08 | 1977-01-20 | Seiko Epson Corp | Semiconductor integrated circuit |
| JPS5379193A (en) * | 1976-12-23 | 1978-07-13 | Westinghouse Electric Corp | Lattice for nuclear fuel assembly |