JPS5036451Y1 - - Google Patents

Info

Publication number
JPS5036451Y1
JPS5036451Y1 JP1970085450U JP8545070U JPS5036451Y1 JP S5036451 Y1 JPS5036451 Y1 JP S5036451Y1 JP 1970085450 U JP1970085450 U JP 1970085450U JP 8545070 U JP8545070 U JP 8545070U JP S5036451 Y1 JPS5036451 Y1 JP S5036451Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1970085450U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1970085450U priority Critical patent/JPS5036451Y1/ja
Publication of JPS5036451Y1 publication Critical patent/JPS5036451Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Bipolar Transistors (AREA)
JP1970085450U 1970-08-27 1970-08-27 Expired JPS5036451Y1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1970085450U JPS5036451Y1 (ja) 1970-08-27 1970-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1970085450U JPS5036451Y1 (ja) 1970-08-27 1970-08-27

Publications (1)

Publication Number Publication Date
JPS5036451Y1 true JPS5036451Y1 (ja) 1975-10-23

Family

ID=33070253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1970085450U Expired JPS5036451Y1 (ja) 1970-08-27 1970-08-27

Country Status (1)

Country Link
JP (1) JPS5036451Y1 (ja)

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