JPS5035556B2 - - Google Patents
Info
- Publication number
- JPS5035556B2 JPS5035556B2 JP231073A JP231073A JPS5035556B2 JP S5035556 B2 JPS5035556 B2 JP S5035556B2 JP 231073 A JP231073 A JP 231073A JP 231073 A JP231073 A JP 231073A JP S5035556 B2 JPS5035556 B2 JP S5035556B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Pyrrole Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP231073A JPS5035556B2 (cg-RX-API-DMAC7.html) | 1972-12-29 | 1972-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP231073A JPS5035556B2 (cg-RX-API-DMAC7.html) | 1972-12-29 | 1972-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4997898A JPS4997898A (cg-RX-API-DMAC7.html) | 1974-09-17 |
| JPS5035556B2 true JPS5035556B2 (cg-RX-API-DMAC7.html) | 1975-11-17 |
Family
ID=11525767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP231073A Expired JPS5035556B2 (cg-RX-API-DMAC7.html) | 1972-12-29 | 1972-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5035556B2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53120362U (cg-RX-API-DMAC7.html) * | 1977-03-03 | 1978-09-25 | ||
| JPS5837825U (ja) * | 1981-09-07 | 1983-03-11 | 株式会社東芝 | コ−ヒ−抽出器 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5156840A (ja) * | 1974-11-13 | 1976-05-18 | Kuraray Co | Suiseisetsuchakuzaisoseibutsu |
| US4760105A (en) * | 1985-10-09 | 1988-07-26 | Westinghouse Electric Corp. | Polyimide modified epoxy resins in aqueous emulsions for lamination and electrodeposition |
| JP7178092B2 (ja) * | 2019-01-31 | 2022-11-25 | ユニチカ株式会社 | イミド基含有樹脂硬化剤 |
-
1972
- 1972-12-29 JP JP231073A patent/JPS5035556B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53120362U (cg-RX-API-DMAC7.html) * | 1977-03-03 | 1978-09-25 | ||
| JPS5837825U (ja) * | 1981-09-07 | 1983-03-11 | 株式会社東芝 | コ−ヒ−抽出器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4997898A (cg-RX-API-DMAC7.html) | 1974-09-17 |